《Open circuit potential of electroless copper plating on tungsten particles》 was written by Liu, Qiang; Xu, Rui-dong; He, Shi-wei. Computed Properties of C4H12KNaO10This research focused ontungsten electroless copper plating open circuit potential. The article conveys some information:
The open circuit potential of electroless copper plating on process was measured by electrochem. workstation, and the copper-coated tungsten composite powder and tungsten strip after plating were characterized. The results showed that during electroless copper plating, the initial open circuit potential was about -600 mV, and changed through slight increase and rapid drop, and became stable at about -870 mV in a short time, then followed a sharp rise, and finally reached -690 mV in 300 s, in the meantime it remained stable and the copper thin-film plating was accomplished. The composite complexing agent of ethylenediamine tetraacetic acid disodium salt (EDTA·2Na) and potassium sodium tartrate tetrahydrate (TART) could facilitate the copper plating reaction through adjusting the charge distribution on the surface of tungsten particles. Trace (≤ 10 mg/L) of 2,2′-bipyridine could effectively restrain the formation of Cu2O and improve the quality of the film. In the part of experimental materials, we found many familiar compounds, such as Potassium sodium (2R,3R)-2,3-dihydroxysuccinate tetrahydrate(cas: 6381-59-5Computed Properties of C4H12KNaO10)
Potassium sodium (2R,3R)-2,3-dihydroxysuccinate tetrahydrate(cas: 6381-59-5) is a ferroelectric crystal with a high piezoelectric effect and electromechanical coupling coefficient. Computed Properties of C4H12KNaO10 Potassium sodium tartrate tetrahydrate has been used in the preparation of Lowry reagent for the determination of microsomal protein concentration in rat hepatic microsomes by Lowry method.
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