Moradi, Sasan published the artcileRemarkable thermal conductivity of epoxy composites filled with boron nitride and cured under pressure, SDS of cas: 7575-23-7, the main research area is boron nitride epoxy resin composite curing thermal conductivity; boron nitride; density; differential scanning calorimetry (DSC); epoxy composites; pressure; thermal conductivity.
This work demonstrates that the application of even moderate pressures during cure can result in a remarkable enhancement of the thermal conductivity of composites of epoxy and boron nitride (BN). Two systems have been used: epoxy-thiol and epoxy-diamine composites, filled with BN particles of different sizes and types: 2, 30 and 180μm platelets and 120μm agglomerates. Using measurements of d. and thermal conductivity, samples cured under pressures of 175 kPa and 2 MPa are compared with the same compositions cured at ambient pressure. The thermal conductivity increases for all samples cured under pressure, but the mechanism responsible depends on the composite system: For epoxy-diamine composites, the increase results principally from a reduction in the void content; for the epoxy-thiol system with BN platelets, the increase results from an improved matrix-particle interface; for the epoxy-thiol system with BN agglomerates, which has a thermal conductivity greater than 10 W/mK at 44.7 volume% filler content, the agglomerates are deformed to give a significantly increased area of contact. These results indicate that curing under pressure is an effective means of achieving high conductivity in epoxy-BN composites.
Polymers (Basel, Switzerland) published new progress about Density. 7575-23-7 belongs to class alcohols-buliding-blocks, name is Pentaerythritol tetra(3-mercaptopropionate), and the molecular formula is C17H28O8S4, SDS of cas: 7575-23-7.
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