Moradi, Sasan published the artcileEpoxy composites filled with boron nitride: cure kinetics and the effect of particle shape on the thermal conductivity, SDS of cas: 7575-23-7, the main research area is epoxy resin boron nitride composite particle size thermal conductivity.
Thermally conducting and elec. insulating materials have been prepared by filling an epoxy-thiol system with boron nitride (BN) particles of different shapes (platelets and agglomerates) and sizes (from 2 to 180μm), and hence with different sp. surface areas. The cure kinetics has been studied by differential scanning calorimetry in both non-isothermal and isothermal modes, and it has been shown that there is a systematic dependence of the cure kinetics on the BN content, the cure reaction generally being retarded by the addition of the BN particles. For filler loadings greater than about 30 vol%, the retardation of the cure, in both isothermal and non-isothermal mode, appears also to decrease as the sp. surface area decreases. For the smallest (2μm) platelets, which have a significantly higher sp. surface area (10 m2 g-1), the retardation is particularly pronounced, and this aspect is rationalized in terms of the activation energy and frequency factor of the reaction. The agglomerates, though, give the highest values of thermal conductivity, contrary to what might be expected in the light of their sp. surface areas. SEM of the fracture surfaces of the cured composites has been used to show that the interface between epoxy matrix and filler particles is better for the agglomerates. This, together with the reduced interfacial area, explains their higher thermal conductivity
Journal of Thermal Analysis and Calorimetry published new progress about Activation energy. 7575-23-7 belongs to class alcohols-buliding-blocks, name is Pentaerythritol tetra(3-mercaptopropionate), and the molecular formula is C17H28O8S4, SDS of cas: 7575-23-7.
Referemce:
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